Electronic device

ABSTRACT

An electronic device includes a display module including a display area and a non-display area. An antenna layer is disposed on the display module, including a bending area at least partially overlapping the non-display area and a non-bending area adjacent to the bending area, and including a first portion disposed in the non-bending area and a second portion disposed in the bending area, and bent, and a spacer disposed between the second portion and the display module and including a metal plate that is bent.

CROSS-REFERENCE TO RELATED APPLICATION

This U.S. non-provisional patent application claims priority under 35U.S.C. § 119 to Korean Patent Application No. 10-2020-0128296, filed onOct. 5, 2020, the contents of which are hereby incorporated by referencein its entirety.

TECHNICAL FIELD

The present disclosure relates to an electronic device. Moreparticularly, the present disclosure relates to an electronic deviceincluding an antenna layer that is bent.

DISCUSSION OF THE RELATED ART

An electronic device includes various electronic modules. For example,where the electronic device is a mobile terminal or a wearable device,the electronic modules may include an antenna module, a camera module,and/or a battery module. As the mobile terminal becomes thin and thewearable device becomes small, a space for the electronic modulesgradually decreases. In addition, as the electronic device becomescapable of performing a wide range of different functions, the number ofelectronic modules included in the electronic device increases.

SUMMARY

An electronic device includes a display module including a display areaand a non-display area. An antenna layer is disposed on the displaymodule. The antenna layer includes a bending area at least partiallyoverlapping the non-display area and a non-bending area adjacent to thebending area. The antenna layer further includes a first portiondisposed in the non-bending area and a second portion disposed in thebending area. The second portion of the antenna layer is bent. A spaceris disposed between the second portion and the display module andincludes a metal plate that is bent.

The spacer may include a first layer adjacent to the second portion, asecond layer adjacent to the display module, and a metal plate disposedbetween the first layer and the second layer.

A curvature of a contact surface of the first layer making contact withthe second portion may be substantially the same as a curvature of thesecond portion.

The metal plate may have a curvature that is substantially the same as acurvature of the second portion.

The display module may include a display panel and an input sensordisposed on the display panel. The antenna layer may be disposed on theinput sensor.

The display panel may include an encapsulation layer. The input sensormay be disposed directly on the encapsulation layer.

The display module may further include a protective layer disposed underthe display panel to protect the display panel. The protective layer mayinclude at least one metal layer.

The metal plate may extend from the metal layer.

The antenna layer may further include a plurality of antennas, aplurality of antenna lines electrically connected to the plurality ofantennas, respectively, and a plurality of antenna pads electricallyconnected to the plurality of antenna lines, respectively.

The antenna layer may have a thickness that is greater than a thicknessof the input sensor.

The plurality of antennas may have a mesh shape.

The antenna layer may further include a third portion disposed on asurface of the display module opposite to a surface on which the firstportion is disposed. The second portion may connect the first portion tothe third portion.

The plurality of antennas may be disposed on the first portion. Theplurality of antenna lines may be disposed on the second portion. Theplurality of antenna pads may be disposed on the third portion.

The electronic device may further include an antenna circuit layerdisposed on the third portion and electrically connected to theplurality of antenna pads.

The display module may include at least one metal layer.

The second portion of the antenna layer may have a thickness that issmaller than a thickness of the first portion.

An electronic device includes a display module including a display areaand a non-display area. An antenna layer is disposed on the displaymodule. The antenna layer includes a bending area at least partiallyoverlapping the non-display area and a non-bending area adjacent to thebending area. The antenna layer further includes a first portiondisposed in the non-bending area and a second portion disposed in thebending area, and the second portion is bent. A metal member is disposedbetween the second portion and the display module. A spacer is disposedbetween the metal member and the second portion.

The metal member may include a first surface adjacent to the spacer anda second surface adjacent to the display module. The first surface mayhave a round shape. The first surface may have a curvature that issubstantially the same as a curvature of the second portion.

The display module may include a plurality of metal layers spaced apartfrom each other.

The metal member may have a semi-circular shape in a cross-section. Adiameter of the semi-circular shape may be substantially the same as aseparation distance between the metal layers.

An electronic device includes a display module including a display areaand a non-display area, a window, and an antenna layer disposed betweenthe display module and the window and at least partially overlappingboth the display area and the non-display area of the display module. Aportion of the antenna layer is bent around the non-display area of thedisplay module such that a portion of the non-display area of thedisplay module is disposed between the antenna layer on two oppositesides thereof.

A spacer may separate a bent portion of the antenna layer from thedisplay module.

An input sensor layer may be disposed between the display area of thedisplay module and the antenna layer.

A display driver may be mounted on a portion of the antenna layer thatis bent around the display module.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other aspects of the present disclosure will becomereadily apparent by reference to the following detailed description whenconsidered in conjunction with the accompanying drawings, wherein:

FIG. 1 is a perspective view illustrating an electronic device accordingto an embodiment of the present disclosure;

FIG. 2 is an exploded perspective view illustrating an electronic deviceaccording to an embodiment of the present disclosure;

FIG. 3 is a cross-sectional view illustrating an electronic deviceaccording to an embodiment of the present disclosure;

FIG. 4 is a cross-sectional view illustrating an electronic deviceaccording to an embodiment of the present disclosure;

FIG. 5 is a plan view illustrating an input sensor according to anembodiment of the present disclosure;

FIG. 6 is a plan view illustrating an antenna layer according to anembodiment of the present disclosure;

FIG. 7 is a plan view illustrating an input sensor and an antenna layeraccording to an embodiment of the present disclosure;

FIG. 8 is a cross-sectional view illustrating an electronic deviceaccording to an embodiment of the present disclosure;

FIG. 9 is a cross-sectional view illustrating an electronic deviceaccording to an embodiment of the present disclosure;

FIGS. 10A to 10C are cross-sectional views illustrating an electronicdevice according to an embodiment of the present disclosure; and

FIG. 11 is a graph illustrating an effect of an electronic deviceaccording to an embodiment of the present disclosure.

DETAILED DESCRIPTION

In the present disclosure, it will be understood that when an element orlayer is referred to as being “on”, “connected to” or “coupled to”another element or layer, it can be directly on, connected or coupled tothe other element or layer or intervening elements or layers may bepresent.

Like numerals may refer to like elements throughout the specificationand the drawings. In the drawings, the thickness, ratio, and dimensionof components may be exaggerated for effective description of thetechnical content. As used herein, the term “and/or” includes any andall combinations of one or more of the associated listed items.

It will be understood that, although the terms first, second, etc. maybe used herein to describe various elements, components, regions, layersand/or sections, these elements, components, regions, layers and/orsections should not necessarily be limited by these terms. These termsare used to distinguish one element, component, region, layer or sectionfrom another region, layer or section. Thus, a first element, component,region, layer or section discussed below could be termed a secondelement, component, region, layer or section without departing from theteachings of the present disclosure. As used herein, the singular forms,“a”, “an” and “the” are intended to include the plural forms as well,unless the context clearly indicates otherwise.

Spatially relative terms, such as “lower”, “upper” and the like, may beused herein for ease of description to describe one element or feature'srelationship to another element(s) or feature(s) as illustrated in thefigures.

It will be further understood that the terms “includes” and/or“including”, when used in this specification, specify the presence ofstated features, integers, steps, operations, elements, and/orcomponents, but do not preclude the presence or addition of one or moreother features, integers, steps, operations, elements, components,and/or groups thereof.

Hereinafter, the present disclosure will be explained in detail withreference to the accompanying drawings.

FIG. 1 is a perspective view illustrating an electronic device EDaccording to an embodiment of the present disclosure.

Referring to FIG. 1 , the electronic device ED may be activated inresponse to electrical signals. For example, the electronic device EDmay be a mobile phone, a tablet computer, a vehicle navigation unit, ahandheld game console, or a wearable unit, however, the presentinvention need not be limited thereto or thereby. FIG. 1 shows themobile phone as a representative example of the electronic device ED.The electronic device ED may be a communication unit.

The electronic device ED may include a display area AA and a non-displayarea NAA. The non-display area NAA may be a peripheral area at leastpartially surrounding the display area AA. The electronic device ED maydisplay an image through the display area AA.

A thickness direction of the electronic device ED may be substantiallyparallel to a third direction DR3 crossing a first direction DR1 and asecond direction DR2. Accordingly, front (or upper) and rear (or lower)surfaces of each member of the electronic device ED may be defined withrespect to the third direction DR3. The expression “viewed in a plane”may mean a state of being viewed in the third direction DR3. Theexpression “viewed in a cross-section” may mean that the cross-sectionof the electronic device ED in the third direction DR3 is viewed in thefirst direction DR1 or the second direction DR2.

FIG. 2 is an exploded perspective view illustrating the electronicdevice ED according to an embodiment of the present disclosure, and FIG.3 is a cross-sectional view illustrating the electronic device EDaccording to an embodiment of the present disclosure.

Referring to FIGS. 2 and 3 , the electronic device ED may include awindow WD, an antenna layer AL, and a display module DM.

The window WD may include an optically transparent insulating material.For example, the window WD may include glass or plastic. The window WDmay have a single-layer or multi-layer structure. For example, thewindow WD may include a plurality of plastic films attached to eachother by an adhesive or may include a glass substrate and a plastic filmattached to the glass substrate by an adhesive.

The window WD may be divided into a transmission area TA and a bezelarea BZA in a plane. The transmission area TA may be an opticallytransparent area. The bezel area BZA may be an area having a lighttransmittance that is lower than that of the transmission area TA. Thebezel area BZA may define a shape of the transmission area TA. The bezelarea BZA may be disposed adjacent to the transmission area TA and maysurround the transmission area TA on one or more sides (e.g., the bezelarea BZA may at least partially surround the transmission area TA).

The bezel area BZA may have a predetermined color. The bezel area BZAmay at least partially cover the peripheral area NAA of the displaymodule DM to prevent the peripheral area NAA from being seen. However,this is merely an example, and the bezel area BZA may be omitted fromthe window WD.

According to an embodiment, the window WD may include a thin film glass.The thin film glass may have a thickness equal to or smaller than about30 um.

The display module DM may include a display panel DP, an input sensorIS, and a protective layer CP.

The display panel DP may include a base layer and a display layer. Thebase layer may include a synthetic resin layer. The synthetic resinlayer may include a heat-curable resin. The base layer may have amulti-layer structure. The base layer may include a glass substrate oran organic/inorganic composite substrate.

The display layer may be disposed on the base layer. The display layermay include a configuration that substantially generates the image. Thedisplay layer may be a light emitting type display layer. For example,the display layer may be, but is not necessarily limited to being, anorganic light emitting display (OLED) layer, a quantum dot displaylayer, or a micro-LED display layer. Alternatively, the display layermay be a backlight unit or a transmittance control layer that controls atransmittance of a light provided thereto from the outside. For example,the display layer may include liquid crystal molecules. The displaylayer will be described in more detail with reference to FIG. 4 .

The input sensor IS may be disposed on the display panel DP. The inputsensor IS may sense an external input applied to the display module DMfrom the outside. The external input may be a user input such as a partof user's body, light, heat, the presence of a stylus pen, or pressure.

The input sensor IS may be formed on the display panel DP throughsuccessive processes. For example, the input sensor IS may be disposeddirectly on the display panel DP such that there are no interveningelements present between the input sensor IS and the display panel DP.For example, a separate adhesive member might not be disposed betweenthe input sensor IS and the display panel DP.

The protective layer CP may be disposed under the display panel DP andmay protect the display panel DP from external impact and interference.The protective layer CP may include a variety of functional layers. Forexample, the protective layer CP may include a heat dissipation layer, asupport layer, a cushion layer, and a shielding layer that shields thedisplay panel DP from a battery. The protective layer CP may include atleast one metal layer.

The antenna layer AL may be disposed on the input sensor IS. The antennalayer AL may transmit, receive, or both transmit and receive a wirelesscommunication signal, for example, a radio frequency signal. The antennalayer AL may be referred to as a radio frequency device. The antennalayer AL may include a plurality of antennas (or a plurality ofradiating portions). The antennas may transmit, receive, or bothtransmit and receive the same frequency band as each other or maytransmit, receive, or both transmit and receive different frequencybands from each other.

The antenna layer AL may be formed on the input sensor IS throughsuccessive processes. For example, the antenna layer AL may be disposeddirectly on the input sensor IS. Accordingly, a third component mightnot be placed between the antenna layer AL and the input sensor IS.According to the present disclosure, the display panel DP, the inputsensor IS, and the antenna layer AL may be formed through successiveprocesses, and the third component might not be placed between thedisplay panel DP, the input sensor IS, and the antenna layer AL.Accordingly, the transmittance of the electronic device ED may beincreased, and a slim electronic device ED may be implemented.

The antenna layer AL may be disposed in the display area AA (refer toFIG. 1 ). Although the electronic device ED becomes smaller or thinneror the peripheral area NAA (refer to FIG. 1 ) around the display area AA(refer to FIG. 1 ) may be decreased, a space for the antenna layer ALmay be obtained since the size of the display area AA (refer to FIG. 1 )is unlikely to be reduced.

FIG. 4 is a cross-sectional view illustrating the electronic device EDaccording to an embodiment of the present disclosure.

Referring to FIG. 4 , the display panel PD may include a circuit layer201, a light emitting element layer 202, and an encapsulation layer 203.The display panel DP may include a plurality of insulating layers, asemiconductor pattern, a conductive pattern, and a signal line. Aninsulating layer, a semiconductor layer, and a conductive layer may beformed by a coating or depositing process. Then, the insulating layer,the semiconductor layer, and the conductive layer may be selectivelypatterned through one or more photolithography processes. Thesemiconductor pattern, the conductive pattern, and the signal lineincluded in the circuit layer 201 and the light emitting element layer202 may be formed. Then, the encapsulation layer 203 at least partiallycovering the light emitting element layer 202 may be formed.

At least one inorganic layer may be formed on an upper surface of thebase layer 100. The inorganic layer may include aluminum oxide, titaniumoxide, silicon oxide, silicon oxynitride, zirconium oxide, and/orhafnium oxide. The inorganic layer may be formed in multiple layers.These multiple inorganic layers may form a barrier layer and/or a bufferlayer. In an embodiment, the display panel DP may include a buffer layerBFL.

The buffer layer BFL may increase a coupling force between the baselayer 100 and the semiconductor pattern. The buffer layer BFL mayinclude a silicon oxide layer and a silicon nitride layer. The siliconoxide layer and the silicon nitride layer may be alternately stackedwith each other.

The semiconductor pattern may be disposed on the buffer layer BFL. Thesemiconductor pattern may include polysilicon, however, the presentinvention need not be limited thereto or thereby. The semiconductorpattern may include amorphous silicon or metal oxide.

FIG. 4 shows only a portion of the semiconductor pattern, and thesemiconductor pattern may be further disposed in other areas. Thesemiconductor pattern may be arranged over the pixels according to adesired arrangement. The semiconductor pattern may have differentelectrical properties depending on whether it is doped or not. Thesemiconductor pattern may include a doped region and a non-doped region.The doped region may be doped with an N-type dopant or a P-type dopant.A P-type transistor may include a doped region doped with the P-typedopant, and an N-type transistor may include a doped region doped withthe N-type dopant.

The doped region may have a conductivity that is greater than that ofthe non-doped region and may substantially serve as an electrode orsignal line. The non-doped region may substantially correspond to anactive region (or a channel) of the transistor. For example, a portionof the semiconductor pattern may be the active region of the transistor,another portion of the semiconductor pattern may be a source or a drainof the transistor, and the other portion of the semiconductor patternmay be a connection electrode or a connection signal line.

Each of the pixels may have an equivalent circuit that includes seventransistors, one capacitor, and a light emitting element, and theequivalent circuit may be changed in various ways. FIG. 4 shows onetransistor 100PC among the seven transistors included in the pixel andthe light emitting element 100PE included in the pixel.

A source C1, an active region A1, and a drain D1 of the transistor 100PCmay be formed from the semiconductor pattern. The source C1 and thedrain DLI may extend in opposite directions to each other from theactive region A1 in a cross-section. FIG. 4 shows a portion of theconnection signal line SCL formed from the semiconductor pattern. Theconnection signal line SCL may be connected to the transistor 100PC whenviewed in a plane. Accordingly, the drain D1 of the transistor 100PC maybe connected to a first electrode AE of the light emitting element 100PEvia the connection signal line SCL.

A first insulating layer 10 may be disposed on the buffer layer BFL. Thefirst insulating layer 10 may commonly overlap the pixels (e.g., thesingle first insulating layer 10 may overlap all of the pixels) and mayat least partially cover the semiconductor pattern. The first insulatinglayer 10 may be an inorganic layer and/or an organic layer and may havea single-layer or multi-layer structure. The first insulating layer 10may include aluminum oxide, titanium oxide, silicon oxide, siliconoxynitride, zirconium oxide, and/or hafnium oxide. In an embodiment, thefirst insulating layer 10 may have a single-layer structure of a siliconoxide layer. An insulating layer of the circuit layer 201, describedbelow, may also be an inorganic layer and/or an organic layer and mayhave a single-layer or multi-layer structure. The inorganic layer mayinclude at least one of the above-mentioned materials, however, thepresent invention need not be limited exclusively to this particulararrangement.

A gate G1 of the transistor 100PC may be disposed on the firstinsulating layer 10. The gate G1 may be a portion of a metal pattern.The gate G1 may at least partially overlap the active region A1. Thegate G1 may be used as a mask in a process of doping the semiconductorpattern.

A second insulating layer 20 may be disposed on the first insulatinglayer 10 and may at least partially cover the gate G1. The secondinsulating layer 20 may commonly overlap the pixels. The secondinsulating layer 20 may be an inorganic layer and/or an organic layerand may have a single-layer or multi-layer structure. In an embodiment,the second insulating layer 20 may have a single-layer structure of asilicon oxide layer.

A third insulating layer 30 may be disposed on the second insulatinglayer 20. In an embodiment, the third insulating layer 30 may have asingle-layer structure of a silicon oxide layer. A first connectionelectrode CNE1 may be disposed on the third insulating layer 30. Thefirst connection electrode CNE1 may be connected to the connectionsignal line SCL through a contact hole CNT-1 defined through the first,second, and third insulating layers 10, 20, and 30.

A fourth insulating layer 40 may be disposed on the third insulatinglayer 30. The fourth insulating layer 40 may have a single-layerstructure of a silicon oxide layer. A fifth insulating layer 50 may bedisposed on the fourth insulating layer 40. The fifth insulating layer50 may be an organic layer.

A second connection electrode CNE2 may be disposed on the fifthinsulating layer 50. The second connection electrode CNE2 may beconnected to the first connection electrode CNE1 through a contact holeCNT-2 defined through the fourth insulating layer 40 and the fifthinsulating layer 50.

A sixth insulating layer 60 may be disposed on the fifth insulatinglayer 50 and may at least partially cover the second connectionelectrode CNE2. The sixth insulating layer 60 may be an organic layer.

The light emitting element layer 202 including the light emittingelement 100PE may be disposed on the circuit layer 201. The lightemitting element 100PE may include the first electrode AE, a lightemitting layer EL, and the second electrode CE.

The first electrode AE may be disposed on the sixth insulating layer 60.The first electrode AE may be connected to the second connectionelectrode CNE2 through a contact hole CNT-3 defined through the sixthinsulating layer 60.

A pixel definition layer 70 may be disposed on the sixth insulatinglayer 60 and may at least partially cover a portion of the firstelectrode AE. An opening 70-OP may be defined through the pixeldefinition layer 70. At least a portion of the first electrode AE may beexposed through the opening 70-OP of the pixel definition layer 70.

As shown in FIG. 4 , the display panel DP may include a light emittingarea PXA and a peripheral area NPXA proximate to the light emitting areaPXA, which are defined in the display panel DP. In an embodiment, thelight emitting area PXA may be defined to correspond to the portion ofthe first electrode A E exposed through the opening 70-OP. The lightemitting area PXA may be provided in plural, and the peripheral areaNPXA may at least partially surround the light emitting areas PXA. Thelight emitting area PXA and the peripheral area NPXA may be defined inthe display area AA of the electronic device ED.

The light emitting layer EL may be disposed on the first electrode AE.The light emitting layer EL may be disposed in an area corresponding tothe opening 70-OP. For example, the light emitting layer EL may beformed in each of the pixels after being divided into plural portions.When the light emitting layer EL is formed in each of the pixels afterbeing divided into plural portions, each of the light emitting layers ELmay emit a light having at least one of blue, red, and green colors,however, the present invention need not be limited exclusively to thisparticular arrangement. The light emitting layer EL may be connected tothe pixels and the light emitting layer EL may be commonly provided(e.g., one singular light emitting layer EL may be connected to all ofthe pixels). In this case, the light emitting layer EL may provide ablue light or a white light.

The second electrode CE may be disposed on the light emitting layer EL.The second electrode CE may have an integral shape and may be commonlydisposed over the pixels (e.g., one singular second electrode CE may bedisposed over all of the pixels).

A hole control layer may be disposed between the first electrode AE andthe light emitting layer EL. The hole control layer may be commonlydisposed in the light emitting area PXA and the peripheral area NPXA(e.g., a single hole control layer may be disposed in both the lightemitting area PXA and the peripheral area NPXA). The hole control layermay include a hole transport layer and may further include a holeinjection layer. An electron control layer may be disposed between thelight emitting layer EL and the second electrode CE. The electroncontrol layer may include an electron transport layer and may furtherinclude an electron injection layer. The hole control layer and theelectron control layer may be commonly formed in the plural pixels usingan open mask (e.g., a single mask may be used to form both the holecontrol layer and the electron control layer for all of the pixels).

The encapsulation layer 203 may be disposed on the light emittingelement layer 202. The encapsulation layer 203 may include an inorganiclayer, an organic layer, and an inorganic layer, which are sequentiallystacked, however, layers included in the encapsulation layer 203 neednot be limited exclusively to this particular arrangement. The inorganiclayers may protect the light emitting element layer 202 from moistureand oxygen, and the organic layer may protect the light emitting elementlayer 202 from a foreign substance such as dust particles. The inorganiclayers may include a silicon nitride layer, a silicon oxynitride layer,a silicon oxide layer, a titanium oxide layer, or an aluminum oxidelayer. The organic layer may include an acrylic-based organic layer,however, the present invention need not be limited exclusively to thisparticular arrangement.

The input sensor IS may include a base insulating layer 301, a firstsensing conductive layer 302, a sensing insulating layer 303, and asecond sensing conductive layer 304.

The base insulating layer 301 may be an inorganic layer that includessilicon nitride, silicon oxynitride, or silicon oxide. Alternatively,the base insulating layer 301 may be an organic layer that includes anepoxy resin, an acrylic resin, or an imide-based resin. The baseinsulating layer 301 may have a single-layer structure or a multi-layerstructure of layers stacked in the third direction DR3.

Each of the first and second sensing conductive layers 302 and 304 mayhave a single-layer structure or a multi-layer structure of layersstacked in the third direction DR3.

The conductive layer having the single-layer structure may include ametal layer or a transparent conductive layer. The metal layer mayinclude molybdenum, silver, titanium, copper, aluminum, or alloysthereof. The transparent conductive layer may include a transparentconductive oxide, such as indium tin oxide (ITO), indium zinc oxide(IZO), zinc oxide (ZnO), indium zinc tin oxide (ITZO), or the like. Inaddition, the transparent conductive layer may include conductivepolymer such as PEDOT, metal nanowire, graphene, or the like.

The conductive layer having the multi-layer structure may include metallayers. The metal layers may have a three-layer structure oftitanium/aluminum/titanium. The conductive layer having the multi-layerstructure may include at least one metal layer and at least onetransparent conductive layer.

The input sensor IS may obtain information on the external input on thebasis of a variation in mutual capacitance or may obtain the informationon the external input on the basis of a variation in self-capacitance.For example, the input sensor IS may include a plurality of sensingelectrodes 310 and 320 (refer to FIG. 4 ). Each of the sensingelectrodes 310 and 320 (refer to FIG. 4 ) may include patterns includedin the first sensing conductive layer 302 and/or the second sensingconductive layer 304.

The sensing insulating layer 303 may include an inorganic layer. Theinorganic layer may include aluminum oxide, titanium oxide, siliconoxide, silicon oxynitride, zirconium oxide, and/or hafnium oxide.

The sensing insulating layer 303 may include an organic layer. Theorganic layer may include an acrylic-based resin, a methacrylic-basedresin, a polyisoprene, a vinyl-based resin, an epoxy-based resin, aurethane-based resin, a cellulose-based resin, a siloxane-based resin, apolyimide-based resin, a polyamide-based resin, and/or a perylene-basedresin.

The antenna layer AL may include a cover insulating layer 305, anantenna conductive layer 401, and an antenna insulating layer 402.

The cover insulating layer 305 may include an inorganic layer. Theinorganic layer may include aluminum oxide, titanium oxide, siliconoxide, silicon oxynitride, zirconium oxide, and/or hafnium oxide.

Alternatively, the cover insulating layer 305 may include an organiclayer. The organic layer may include an acrylic-based resin, amethacrylic-based resin, a polyisoprene, a vinyl-based resin, anepoxy-based resin, a urethane-based resin, a cellulose-based resin, asiloxane-based resin, a polyimide-based resin, a polyamide-based resin,and/or a perylene-based resin.

The cover insulating layer 305 may include a dielectric substance havinga specific dielectric constant.

The antenna conductive layer 401 may be disposed on the cover insulatinglayer 305. The antenna conductive layer 401 may have a single-layerstructure or a multi-layer structure of layers stacked in the thirddirection DR3. The antenna conductive layer 401 may includesubstantially the same material as that of the first sensing conductivelayer 302 or the second sensing conductive layer 304 described above.

The antenna conductive layer 401 may include a plurality of antennas 410(refer to FIG. 6 ). Accordingly, the antennas 410 (refer to FIG. 6 ) maybe disposed directly on the cover insulating layer 305. A lower surfaceof the antennas 410 (refer to FIG. 6 ) may be in direct contact with anupper surface of the cover insulating layer 305 or an upper surface ofthe input sensor IS.

The antenna conductive layer 401 may have a thickness 401 t greater thana thickness of each of the first sensing conductive layer 302 and thesecond sensing conductive layer 304. For example, the thickness 401 t ofthe antenna conductive layer 401 may be equal to or greater than about1.3 times a thickness 302 t of the first sensing conductive layer 302and may be equal to or smaller than about two times the thickness 302 tof the first sensing conductive layer 302. For example, the thickness302 t of the first sensing conductive layer 302 may be within a range ofabout 2500 angstroms to about 3000 angstroms, and the thickness 401 t ofthe antenna conductive layer 401 may be within a range of about 4000angstroms to about 6000 angstroms. Accordingly, the antenna conductivelayer 401 may have a resistance smaller than a resistance of the firstsensing conductive layer 302 under the condition that an area of theantenna conductive layer 401 is the same as an area of the first sensingconductive layer 302 when viewed in a plane.

The antenna insulating layer 402 may at least partially cover theantenna conductive layer 401 and may provide a flat (e.g., planar)surface thereon. The antenna insulating layer 402 may include an organiclayer. The organic layer may include an acrylic-based resin, amethacrylic-based resin, a polyisoprene, a vinyl-based resin, anepoxy-based resin, a urethane-based resin, a cellulose-based resin, asiloxane-based resin, a polyimide-based resin, a polyamide-based resin,and/or a perylene-based resin.

Openings 300 op and 400 op may be defined through the first sensingconductive layer 302, the second sensing conductive layer 304, and theantenna conductive layer 401. For example, the opening 3000 p providedin the second sensing conductive layer 304 may be an opening provided inthe plural sensing electrodes 310 and 320 (refer to FIG. 5 ), and theopening 400 op provided in the antenna conductive layer 401 may be anopening provided in the plural antennas 410 (refer to FIG. 6 ).

When viewed in the thickness direction of the display panel DP, e.g.,the third direction DR3, the openings 300 op and 400 op may at leastpartially surround the light emitting area PXA. For example, when viewedin the thickness direction DR3 of the display panel DP, the conductivepatterns included in each of the first sensing conductive layer 302, thesecond sensing conductive layer 304, and the antenna conductive layer401 may at least partially overlap the peripheral area NPXA and may bespaced apart from the light emitting area PXA.

FIG. 5 is a plan view illustrating the input sensor IS according to anembodiment of the present disclosure. FIG. 6 is a plan view illustratingthe antenna layer AL according to an embodiment of the presentdisclosure. FIG. 7 is a plan view illustrating the input sensor and theantenna layer according to an embodiment of the present disclosure.

Referring to FIGS. 4 and 5 , the base layer 100 may include a first basearea 101, a second base area 102, and a third base area 103, which aredefined therein. The first base area 101 may at least partially overlapthe light emitting area PXA and the peripheral area NPXA shown in FIG. 4. In addition, the first base area 101 may at least partially overlapthe display area AA of the electronic device ED (refer to FIG. 1 ).

The second base area 102 may extend from a first edge portion 101 el ofthe first base area 101. The third base area 103 may extend from thesecond base area 102.

The second base area 102 may be bent toward a rear surface of the firstbase area 101 when the electronic device ED (refer to FIG. 1 ) isassembled. Accordingly, the third base area 103 of the electronic deviceED (refer to FIG. 1 ) may be disposed on the rear surface of the firstbase area 101. As used herein, the term “bent” is intended to mean thatthe element has a non-planar shape that is curved, regardless of whetherthat element was formed with the curve or was formed flat and then bent.

The input sensor IS may include a plurality of first sensing electrodes310, a plurality of second sensing electrodes 320, a plurality ofsensing lines 330, and a plurality of sensing pads 340.

The first sensing electrodes 310 and the second sensing electrodes 320may be disposed in the display area AA. The input sensor IS may obtainthe information on the external input based on a variation in mutualcapacitance between the first sensing electrodes 310 and the secondsensing electrodes 320.

The first sensing electrodes 310 may be arranged in the first directionDR1 and they may be spaced apart from each other. Each of the firstsensing electrodes 310 may extend in the second direction DR2. Thesecond sensing electrodes 320 may be arranged in the second directionDR2 and they may be spaced apart from each other. Each of the secondsensing electrodes 320 may extend in the first direction DR1.

Each of the first sensing electrodes 310 may include a plurality ofsensing patterns 311 and a bridge pattern 312 electrically connected totwo sensing patterns 311 adjacent to each other among the sensingpatterns 311.

The sensing patterns 311 and the bridge pattern 312 may be disposed ondifferent layers from each other. For example, in a case where thebridge pattern 312 is included in the first sensing conductive layer302, the sensing patterns 311 may be included in the second sensingconductive layer 304. Alternatively, in a case where the bridge pattern312 is included in the second sensing conductive layer 304, the sensingpatterns 311 may be included in the first sensing conductive layer 302.

Each of the second sensing electrodes 320 may include a plurality offirst portions 321 and a second portion 322 defined between the firstportions 321 adjacent to each other among the first portions 321. Thefirst portions 321 may be referred to as sensing portions, and thesecond portion 322 may be referred to as a connection portion or acrossing portion.

The first portions 321 may be provided integrally with the secondportion 322 (e.g., the first portions 321 and the second portions 322may be one continuous structure with each other). Accordingly, thesecond portion 322 may be defined as a portion crossing the bridgepattern 312 in each of the second sensing electrodes 320. The firstportions 321 and the second portion 322 may be disposed on the samelayer, and in addition, the first portions 321 and the second portion322 may be disposed on the same layer as the sensing patterns 311.

Each of the first sensing electrodes 310 and each of the second sensingelectrodes 320 may be electrically connected to at least one of thesensing lines 330. For example, one first sensing electrode 310 may beconnected to two sensing lines 330. One sensing line 330 of the twosensing lines 330 may be electrically connected to one end of the firstsensing electrode 310, and the other sensing line 330 of the two sensinglines 330 may be electrically connected to the other end of the firstsensing electrode 310. One second sensing electrode 320 may beelectrically connected to one sensing line 330. However, a connectionrelation of the sensing lines 330 with respect to the first sensingelectrodes 310 and the second sensing electrodes 320 need not be limitedexclusively to this particular arrangement.

The sensing pads 340 may be electrically connected to the sensing lines330, respectively. The sensing pads 340 may be disposed in the thirdbase area 103. Driving chip pads 210 may be disposed in the third basearea 103. A driving chip that is electrically connected to the displaymodule DM may be disposed on the driving chip pads 210.

The antenna layer AL may include the antennas 410, a plurality ofantenna lines 420, and a plurality of antenna pads 430. FIG. 6 showsfour antennas 410 as a representative example, however, the number ofthe antennas 410 included in the electronic device ED (refer to FIG. 1 )need not be limited to this particular arrangement.

The antenna layer AL may include a first portion P1, a second portionP2, and a third portion P3. The first, second, and third portions P1,P2, and P3 may include the cover insulating layer 305. The first portionP1 may at least partially overlap the display area AA, and the secondportion P2 may at least partially overlap a bending area BA. The thirdportion P3 may extend from the second portion P2.

The antenna lines 420 may be electrically connected to the antennas 410,respectively. The antenna pads 430 may be electrically connected to theantenna lines 420, respectively. The antennas 410 may be disposed on thefirst portion P1, the antenna lines 420 may be disposed on the secondportion P2, and the antenna pads 430 may be disposed on the thirdportion P3. The antennas 410 may have a mesh shape.

An antenna circuit layer A-FPC (refer to FIG. 2 ) may be furtherdisposed on the third portion P3. An antenna driving chip A-1C (refer toFIG. 2 ) may be electrically connected to the antenna circuit layerA-FPC (refer to FIG. 2 ). In this case, pads that are electricallyconnected to a film on which the antenna driving chip A-IC (refer toFIG. 2 ) is mounted may be further provided.

In FIG. 7 , each of the antennas 410 may be included in the antennaconductive layer 401. The antennas 410 may be disposed in the displayarea AA. Accordingly, each of the antennas 410 may at least partiallyoverlap a portion of the first sensing electrodes 310 or a portion ofthe second sensing electrodes 320.

FIG. 8 is a cross-sectional view illustrating the electronic deviceaccording to an embodiment of the present disclosure. FIG. 8 shows thecross-section taken along a line X-X′ of FIG. 2 . FIG. 9 is across-sectional view illustrating the electronic device according to anembodiment of the present disclosure.

FIG. 8 shows a state in which the second portion P2 of the antenna layerAL is not bent (e.g., the antenna layer AL has a planar shape), and FIG.9 shows a state in which the second portion P2 of the antenna layer ALof FIG. 8 is bent (e.g., the antenna layer AL has a curved shape).

Referring to FIGS. 8 and 9 , the electronic device ED (refer to FIG. 1 )may include the window WD, the antenna layer AL, and the display moduleDM. The electronic device ED may include an anti-reflective layer POLdisposed on the antenna layer AL.

The electronic device ED may include a first adhesive layer AD1 disposedbetween the input sensor IS and the antenna layer AL. The electronicdevice ED may include a second adhesive layer AD2 disposed between thewindow WD and the anti-reflective layer POL. According to an embodiment,the first and the second adhesive layers AD1 and AD2 may be omitted.

The input sensor IS may be disposed directly on the encapsulation layer203. For example, there might be no other components disposed betweenthe input sensor IS and the encapsulation layer 203.

In FIGS. 8 and 9 , the bending area BA may be defined in the non-displayarea NAA. A light blocking pattern BM may be disposed in the non-displayarea NAA, and the bending area BA may at least partially overlap thelight blocking pattern BM. In FIG. 8 , in a case where the antenna layerAL is not bent, a length of the light blocking pattern BM of thenon-display area NAA increases such that the antenna layer AL is hidden.In FIG. 9 , the antenna layer AL may be bent in the bending area BA, andthus, the length of the light blocking pattern BM may decrease. Forexample, in the electronic device ED (refer to FIG. 1 ) according to anembodiment of the present disclosure, the bezel area in which the lightblocking pattern BM corresponding to a dead space is included maydecrease.

Referring to FIG. 9 , the display module DM may be disposed in anon-bending area NBA. The non-bending area NBA may be defined adjacentto the bending area BA and may be defined in portions of the displayarea AA and the non-display area NAA.

The display module DM may include the display panel DP, the input sensorIS, the protective layer CP, and a pattern film PF.

The pattern film PF may be a thin film in which various patterns areformed.

The display panel DP may include the display layer DL, a first metallayer MTL1, and the encapsulation layer 203.

The first metal layer MTL1 may reflect a radiation signal incident intothe display module DM. For example, the first metal layer MTL1 may serveas a lower ground of the antenna layer AL. According to an embodiment,the first metal layer MTL1 may correspond to a cathode electrode. Forexample, the second electrode CE may be the first metal layer MTL1 inFIG. 4 , however, the present invention need not be limited exclusivelyto this particular arrangement. Components included in the displaymodule and containing a metal material may correspond to the first metallayer MTL1.

The display layer DL may include the circuit layer 201 and the lightemitting element layer 202 of FIG. 4 .

The protective layer CP may include a first protective layer CL1, asecond protective layer CL2, and a second metal layer MTL2. The secondmetal layer MTL2 may be disposed between the first protective layer CL1and the second protective layer CL2. The second metal layer MTL2 maycorrespond to a support layer or a shielding layer to protect thedisplay panel DP. The first and second metal layers MTL1 and MTL2 mayinclude aluminum, copper, stainless steel (SUS), or the like, and thefirst and second metal layers MTL1 and MTL2 need not be particularlylimited to the use of these metals. The second metal layer MTL2 mayserve as a lower ground of the antenna layer AL. The display module DMused here may be at least similar to the display modules DM describedelsewhere in this specification.

The antenna layer AL may include the first portion P1 disposed on onesurface of the display module DM and the third portion P3 disposed onthe other surface of the display module DM. The first portion P1 and thethird portion P3 may be connected to each other by the second portionP2. The second portion P2 may be disposed in the bending area BA, andthe first portion P1 and the third portion P3 may be disposed in thenon-bending area NBA. The second portion P2 may connect the firstportion P1 and the third portion P3, which are disposed on oppositesurfaces to each other of the display module DM, while being bent.

There is substantially no empty space between the first portion P1 andan upper surface of the display module DM, and there is substantially noempty space between the third portion P3 and a lower surface of thedisplay module DM. In an embodiment, the upper surface of the displaymodule DM may be a surface facing the window WD, and the lower surfaceof the display module DM may be a surface opposite to the upper surface.A side surface FP may connect the upper surface and the lower surface.However, an empty space may exist between the second portion P2 and thedisplay module DM. The empty space may be defined by an inner sidesurface CP of the second portion P2 and the side surface FP of thedisplay module DM.

In an embodiment, the empty space may be at least partially filled witha spacer SPC. For example, the spacer SPC may be disposed between thesecond portion P2 and the display module DM. The spacer SPC may includea dielectric substance. The spacer SPC may have a dielectric constantvariably determined by taking into account antenna characteristics. Thespacer SPC may include a first layer L1, a second layer L2, and a metalplate MP. The first layer L1 may be disposed adjacent to the secondportion P2, and the second layer L2 may be disposed adjacent to thedisplay module. A curvature of a surface of the first layer L1 that isin contact with the second portion P2 may be substantially the same as acurvature of the second portion P2. As used herein, having the samecurvature may mean that the two elements have equal radii of curvature.For example, a radius of curvature of the surface of the first layer L1may equal a radius of curvature of the second portion P2.

The metal plate MP may be disposed between the first layer L1 and thesecond layer L2. The metal plate MP may include a metal material, suchas aluminum, copper, etc., however, other metals may be used. The metalplate MP may be in a bent state. The metal plate MP may have a curvaturethat is substantially the same as a curvature of the second portion P2.The metal plate MP may prevent the signal radiated from the secondportion P2 from traveling toward the inside of the display module DM.For example, the signal radiated from the antenna layer AL may beradiated to the outside of the electronic device ED by the metal plateMP as well as by the first and second metal layers MTL1 and MTL2 withoutbeing absorbed into the display module DM. Accordingly, the performanceof the antenna may be increased.

The second portion P2 and the metal plate MP may be spaced apart fromeach other. A separation distance WT1 between the second portion P2 andthe metal plate MP may be greater than or equal to about 50 um. Theseparation distance WT1 need not be limited to the specified range andmay be determined by taking into account antenna characteristics, e.g.,an impedance matching, of the antennas of the antenna layer AL. However,a distance between the metal plate MP that serves as the lower groundand the antenna may be required to be equal to or greater than apredetermined value, and the distance may be greater than or equal toabout 50 um. The metal plate MP may have a thickness smaller than athickness of the antenna layer AL.

The thickness of the antenna layer AL may be greater than a thickness ofthe display panel DP and/or the input sensor IS. The thickness of eachof the antennas 410 (refer to FIG. 6 ) may be greater than the thicknessof the display panel DP and/or the input sensor IS.

The electronic device ED may include the antenna circuit layer A-FPC.The antenna circuit layer A-FPC may be disposed on the third portion P3of the antenna layer AL. The antenna driving chip A-IC may be disposedon the antenna circuit layer A-FPC.

FIGS. 10A to 10C are cross-sectional views illustrating an electronicdevice according to an embodiment of the present disclosure.

Referring to FIG. 10A, a metal member MM may be disposed between asecond portion P2 and a display module DM. The metal member MM may be incontact with a side surface of the display module DM. A spacer SPC maybe disposed between the metal member MM and the second portion P2.

The metal member MM may include a first surface S1 adjacent to thespacer SPC and a second surface S2 making contact with a side surface FPof the display module DM. The first surface S1 may have a round shape.The first surface S1 may have a curvature that is substantially the sameas a curvature of the second portion P2. The first surface S1 and thesecond portion P2 may be spaced apart from each other by a distanceequal to or greater than about 50 um. For example, the spacer SPC mayhave a thickness equal to or greater than about 50 um.

In an embodiment, the metal member MM may have a semi-circular shape.The metal member MM may have a diameter that is substantially the sameas a separation distance WT2 between the first metal layer MTL1 and thesecond metal layer MTL2. For example, a length of the second surface S2of the metal member MM may be substantially the same as the separationdistance WT2 between the first metal layer MTL1 and the second metallayer MTL2.

In FIG. 10B, a second portion P2 may have a thickness TH2 smaller than athickness TH1 of a first portion P1 or a third portion P3. For example,the second portion P2 may have the thickness smaller than the thicknessof the first portion P1 and the third portion P3 to be easily bent.

In FIG. 10C, a metal plate MP may extend from a second metal layer MTL2of a protective layer CP. For example, the metal plate MP may be aportion of the second metal layer MTL2. The metal plate MP may be aportion at least partially overlapping a bending area BA of the secondmetal layer MTL2. First and second protective layers CL1 and CL2 mayextend in the bending area BA. For example, the first and secondprotective layers CL1 and CL2 may be filled in an empty space between asecond portion P2 of an antenna layer AL and a display module DM.

In an embodiment, the first and second protective layers CL1 and CL2 mayinclude a dielectric substance having a specific dielectric constant.For example, the first and second protective layers CL1 and CL2 mayinclude at least one insulating layer.

FIG. 11 is a graph illustrating an effect of an electronic deviceaccording to an embodiment of the present disclosure. The graph of FIG.11 will be described with reference to Table 1.

TABLE 1 Reflection Frequency coefficient (S11) Bandwidth (BW)Comparative 28 −14.5 2.2 example 1 (A) Comparative 28 −17.2 2.6 example2 (B) Comparative 28 −22.7 3.2 example 3 (C) Embodiment 28 −34.3 3.5example 4 (D)

Table 1 shows experimental examples to explain the effect of anembodiment of the present disclosure. “D” shows the effect of anembodiment of the present disclosure. In FIGS. 11 , A, B, and Crespectively show comparative examples. Comparative example 1(A),comparative example 2(B), and comparative example 3(C) show exampleshaving different sizes in an empty space (refer to descriptions in FIG.9 ) between a second portion of a bending area and a display module. Thesizes of the empty space may satisfy: A>B>C. In the case of embodimentexample D of the present disclosure, the empty space is in a state ofbeing filled with the spacer and the metal plate. The frequency is setto about 28 GHz in all experimental examples equally.

Referring to Table 1 and FIG. 11 , in comparative examples 1(A), 2(B),and 3(C) respectively corresponding to a case (A) where there is nometal plate serving as a lower ground and cases (B and C) where themetal plate is partially disposed, an absolute value of the reflectioncoefficient S11, which is an indicator of the performance of theantenna, is low. In the case of embodiment example (D), it is observedthat the signals radiated into the display module through the emptyspace are blocked by the metal plate and the absolute value of thereflection coefficient S11 and the bandwidth BW are greater than thoseof comparative examples. For example, as the size of the empty spaceincreases, the antenna efficiency becomes lower as can be seen incomparative examples 1, 2, and 3. In the case of embodiment example (D)in which the empty space is filled with the metal plate or othercomponents, the efficiency of the antenna increases.

Although embodiments of the present disclosure have been described, itis understood that the present disclosure should not necessarily belimited to these embodiments but various changes and modifications canbe made by one ordinary skilled in the art within the spirit and scopeof the present disclosure.

What is claimed is:
 1. An electronic device, comprising: a displaymodule comprising a display area and a non-display area; an antennalayer disposed on the display module, the antenna layer comprising abending area at least partially overlapping the non-display area and anon-bending area adjacent to the bending area, the antenna layer furthercomprising a first portion disposed in the non-bending area and a secondportion disposed in the bending area, the second portion being bent; anda spacer disposed between the second portion and the display module andcomprising a metal plate that is bent.
 2. The electronic device of claim1, wherein the spacer comprises: a first layer adjacent to the secondportion; a second layer adjacent to the display module; and a metalplate disposed between the first layer and the second layer.
 3. Theelectronic device of claim 2, wherein a radius of curvature of a contactsurface of the first layer making contact with the second portion issubstantially the same as a radius of curvature of the second portion.4. The electronic device of claim 2, wherein the metal plate has aradius of curvature that is substantially the same as a radius ofcurvature of the second portion.
 5. The electronic device of claim 1,wherein the display module comprises a display panel and an input sensordisposed on the display panel, and the antenna layer is disposed on theinput sensor.
 6. The electronic device of claim 5, wherein the displaypanel comprises an encapsulation layer, and the input sensor is disposeddirectly on the encapsulation layer.
 7. The electronic device of claim5, wherein the display module further comprises a protective layerdisposed under the display panel, the protective layer comprising atleast one metal layer.
 8. The electronic device of claim 7, wherein themetal plate extends from the at least one metal layer.
 9. The electronicdevice of claim 1, wherein the antenna layer further comprises: aplurality of antennas; a plurality of antenna lines electricallyconnected to the plurality of antennas, respectively; and a plurality ofantenna pads electrically connected to the plurality of antenna lines,respectively.
 10. The electronic device of claim 5, wherein the antennalayer has a thickness that is greater than a thickness of the inputsensor.
 11. The electronic device of claim 9, wherein the plurality ofantennas have a mesh shape.
 12. The electronic device of claim 9,wherein the antenna layer further comprises a third portion, the thirdportion is disposed on a surface of the display module opposite to asurface on which the first portion is disposed, and the second portionconnects the first portion to the third portion.
 13. The electronicdevice of claim 12, wherein the plurality of antennas are disposed onthe first portion, the plurality of antenna lines are disposed on thesecond portion, and the plurality of antenna pads are disposed on thethird portion.
 14. The electronic device of claim 13, further comprisingan antenna circuit layer disposed on the third portion and electricallyconnected to the plurality of antenna pads.
 15. The electronic device ofclaim 1, wherein the display module further comprises at least one metallayer.
 16. The electronic device of claim 1, wherein the second portionof the antenna layer has a thickness that is smaller than a thickness ofthe first portion.
 17. An electronic device, comprising: a displaymodule comprising a display area and a non-display area; an antennalayer disposed on the display module, the antenna layer comprising abending area at least partially overlapping the non-display area and anon-bending area adjacent to the bending area, the antenna layer furthercomprising a first portion disposed in the non-bending area and a secondportion disposed in the bending area, the second portion being bent; ametal member disposed between the second portion and the display module;and a spacer disposed between the metal member and the second portion.18. The electronic device of claim 17, wherein the metal membercomprises a first surface adjacent to the spacer and a second surfaceadjacent to the display module, the first surface having a round shape,and the first surface having a radius of curvature that is substantiallythe same as a radius of curvature of the second portion.
 19. Theelectronic device of claim 17, wherein the display module comprises aplurality of metal layers spaced apart from each other.
 20. Theelectronic device of claim 19, wherein the metal member has asemi-circular shape in a cross-section, and a diameter of thesemi-circular shape is substantially the same as a separation distancebetween neighboring metal layers of the plurality of metal layers. 21.An electronic device, comprising: a display module including a displayarea and a non-display area; a window; an antenna layer disposed betweenthe display module and the window and at least partially overlappingboth the display area and the non-display area of the display module;and a spacer separating a bent portion of the antenna layer from thedisplay module, wherein the bent portion of the antenna layer is bentaround the non-display area of the display module such that a portion ofthe non-display area of the display module is disposed between theantenna layer on two opposite sides thereof.
 22. The electronic deviceof claim 21, wherein the antenna layer includes an antenna disposedbetween the display module and the window and overlapping the displayarea of the display module.
 23. The electronic device of claim 21,further comprising an input sensor layer disposed between the displayarea of the display module and the antenna layer.
 24. The electronicdevice of claim 21, further comprising a display driver mounted on aportion of the antenna layer that is bent around the display module.